【From Berkeley SkyDeck】IC Taiwan Grand Challenge

We would like to share an upcoming opportunity with you: IC Taiwan Grand Challenge. Participating teams need to actively leverage innovative IC design to develop advanced application solutions or enhanced technologies across the following categories: AI core technologies & chips, smart mobility, smart manufacturing, smart med-tech and sustainability. 

Each winning team receives a landing prize of USD 30,000. Additionally, based on specific development needs, teams may access up to USD 3 million in resources for chip development, including EDA tools, silicon intellectual property licensing services, IC design services, and wafer shuttle services. 

Deadline to apply is Monday, June 30.

https://ictaiwanchallenge.org/ Thank you!

我們誠摯分享，邀請新創團隊參與一項重要計劃：「IC Taiwan Grand Challenge」。
參賽團隊需積極運用創新IC設計，針對以下領域開發先進應用解決方案或技術升級方案：AI核心技術與晶片、智慧移動、智慧製造、智慧醫療科技，以及永續發展。

每支獲獎團隊將可獲得3萬美元的落地獎金。另依團隊技術發展需求，最高可申請價值達300萬美元的晶片開發資源，包括EDA工具、矽智財授權服務、IC設計服務與晶圓流片服務等。

計畫申請截止日期為2025年06月30日（星期一）。
https://ictaiwanchallenge.org/，感謝關注與支持！